Our engineers have expertise packaging electronics into many different types of substrates and enclosures. We understand how to design for EM shielding, RF isolation, ingress protection, thermal cooling, vibration and a host of other requirements to the appropriate standards. Our engineers work closely with electrical engineers and designers to capture mechanical outlines and components for PCB layout. We also understand the need to be cost effective and on schedule in fast paced and highly competitive electronic industries.
We have a wealth of experience designing antennas and base station equipment to meet the mechanical requirements of manufacturers and their international carriers. Our engineers are helping to design the next generation of wireless technologies at state-of-the-art research facilities.
We are helping to design and define the next generation of optical interfaces. As electronic designs become increasingly smaller and denser, the associated challenges and solutions for design and production are becoming increasingly more mechanical in nature.
Our thermal analysis skills are helping to keep data center rack switches and shelves cooler and more energy efficient. We have a strong background in conduction, convection and radiative cooling that allows us to thermally optimize products for data center applications.
Our engineers have expertise in mechanical design of radio frequency enclosures, antenna structures, and microwave systems for satellite communications. We have the tools and experience to design highly reliable systems for deployment in the harshest of conditions.